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What happens when you combine semiconductor technology with nanotechnology?
A new technology for chemically shaping the structure of a material, developed at the University of Pennsylvania, combines lithography used in the manufacture of semiconductor devices with nanotechnology known as “molecular self-assembly”. New technology can be used to create multifunctional surfaces.
The essence of the development lies in the use of a lithographic photoresist (a substance that changes its mechanical properties under the influence of light radiation) in order to protect selected areas of the surface. In areas unprotected with resist, the material is selectively removed so that another can be placed in its place. The process can be repeated to create a multi-functional surface.
The first illustration gives some idea of what it looks like. Images were taken using different methods, but they show the same surface. On it, the regions containing molecules terminated by COOH groups alternate with regions in which the molecules terminate with CH3 groups.
The second illustration schematically shows the process of forming such a surface. Organic acid molecules (COOH) are shown in red, which is the first component of a self-assembled monolayer (SAM) – a self-assembled film with a thickness of one molecule. The second component is shown in blue – molecules containing a methyl group (CH3). After applying the first SAM, the resist (shown in green) is applied over it. Further, the part of the first SAM component that is not protected by the resist is removed, and the second SAM component is deposited on this part. The resist prevents the movement and interaction of molecules of different SAM components.
The area of practical application of the new technology, according to the developers, is quite wide. In particular, with the help of multifunctional surfaces, it is possible to select various elements from mixtures or determine their presence – elements of each type will be captured by their own surface areas.
It is important that the technologies underlying the development – lithography and molecular self-assembly – are currently quite well mastered separately and the innovation, in fact, consisted in their combination.