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USB\VID_C&PID_ – BCMA0 Bluetooth Module | Device Hunt
AMD licenses green technology from Amkor
As it became known, Amkor Technology and AMD have entered into a licensing agreement, which gives AMD the opportunity to use the technology developed by Amkor for the electroplating of leads on the surface of semiconductor wafers. Other terms of the agreement were not disclosed.
Amkor technology is special because it does not use lead. In other words, it meets the requirements of the green. As you know, in the electronics industry there is now a real struggle with the use of certain chemical elements and compounds, including lead, mercury, cadmium and halogen.
The process of applying leads to the surface of semiconductor wafers (wafer bumping) consists in the formation of microscopic “bumps” of solder on the surface of a wafer with ready-made chips. It is a key step in the manufacture of microcircuits in which the crystal is connected to ball leads using metallized pads and tracks on the substrate surface (flip-chip IC package). Housings of this type are widely used for microcircuits with a large degree of integration, in particular, microprocessors.
The industry is currently moving from high lead solders to tin silver (SnAg) alloys as lead material. Amkor began its development in this area in 2021.
Source: Amkor Technology