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AMD and IBM prepare to release 45nm processors
At the International Electron Device Meeting (IEDM), IBM and AMD presented talks detailing the details of immersion lithography, ultralow dielectrics, and numerous transistor improvements for 45nm processors. Companies expect to market the first 45nm processors using these technologies in mid-2021.
Recall that in today’s production, conventional lithography is used, which is a significant limiting factor that prevents the development of standards less than 65 nm. It is expected that immersion lithography will allow to master finer standards, in particular, will enable AMD and IBM to produce 45nm microprocessors.
The use of porous dielectrics with a low dielectric constant (ultra-low-K) will reduce the parasitic capacitance of the connections inside the chip and increase its performance, while reducing power consumption.
As for the design of transistors for new microprocessors, AMD and IBM specialists are improving semiconductor “stretching” technologies that allow increasing the speed of semiconductor devices, overcoming the limitations associated with the physical dimensions of their elements, and arising from the transition to the 45-nm process technology. Despite the increase in the density of transistors when using 45-nm standards, IBM and AMD demonstrated an increase in the current in the p-type channel by 80%, and in the n-type channel by 24% compared to modern “unstretched” transistors.
Recall that the beginning of the joint work of IBM and AMD on the development of new technological standards was laid in January 2021. In November last year, it was announced the extension of cooperation until 2021. It is assumed that by that time the parties will approach the development of 32nm and 22nm processes.
Sources: IBM, AMD