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Ralink Technology Demonstrates Next Generation Wireless Solutions at CES | AVING NEWS
Ralink Technology Demonstrates Next Generation Wireless Solutions at CES 2010
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Winbond prepares to release 80nm DRAM
Winbond Electronics announced that the manufacturer is preparing to launch an 80nm DRAM process in the second quarter of this year.
This unusual choice of technology, while most manufacturers report the implementation of 70nm standards, Winbond explains by the fact that it will allow production to continue on existing equipment, currently producing substrates using 90nm process technology.
The company expects the cost of upgrading factories will be negligible, and the chip yield will increase by 10-20%.
Last January, the manufacturer produced 25-26 thousand 300-mm substrates.
Winbond is currently completing the implementation of the 90nm process technology, and even in the current quarter, 110nm DRAM chips will dominate its production structure (39% versus 35% of 90nm products).
Thus, we see that the technological gap between manufacturers of memory of the first and second echelons is increasing every month. For comparison, Samsung released the first 50nm DRAM chip back in the fall. In such conditions it will be difficult for Winbond to compete with the leaders. We are waiting for the takeover of the manufacturer Qimonda, with which it is now in partnership?