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M-audio conectiv.M-Audio Conectiv USB DJ Audio Interface

 

M-audio conectiv

 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

Description.M-Audio CONECTIV Torq Dj Software | ProSound and Stage Lighting

 

M-Audio’s new SynchroScience product development group is all about providing DJs with the tools they need – as evidenced by the portable and powerful Conectiv interface. With two pairs of stereo inputs and outputs, easy USB connectivity and included Torq DJ software, Conectiv can turn any compatible Mac or PC into a powerful DJ rig. Sep 09,  · Conectiv, developed by M-Audio’s SynchroScience division, is the world’s first bus-powered 4 x 4 USB audio interface designed for DJs who perform and produce tracks with a laptop/ Nov 14,  · The inputs can be used either to channel audio into your machine (Conectiv shows up as an audio interface in any audio application) or to accept two channels of time-coded control data (more on this shortly)/5.

 

M-audio conectiv.New Drivers: Synchroscience M-Audio Conectiv

Conectiv, developed by M-Audio’s SynchroScience division, is the world’s first bus-powered 4 x 4 USB audio interface designed for DJs who perform and produce tracks with a laptop. M-Audio’s new SynchroScience product development group is all about providing DJs with the tools they need – as evidenced by the portable and powerful Conectiv interface. With two pairs of stereo inputs and outputs, easy USB connectivity and included Torq DJ software, Conectiv can turn any compatible Mac or PC into a powerful DJ rig. Apr 27,  · Conectiv, developed by M-Audio s SynchroScience division, is the world s M-Audio Conectiv Controller can be controlled via mouse, keyboard, MIDI controller or control vinyl/CDs. M-Audio’s new SynchroScience product development group is all about providing DJs with the tools they need as evidenced by the portable and powerful Conectiv interface.
 
 
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Product Description
M-Audio Conectiv USB DJ Audio Interface
Samsung predicts ‘era of merger’

Samsung Electronics Shares Stunning Prospects for New Technology Allegedly Changing the Semiconductor Industry. We are talking about the so-called “three-dimensional silicon”. Speaking at the 2021 International Electron Devices Meeting (IEDM), President and CEO of the semiconductor business, Dr. Chang-Gyu Hwang, said the world is on the cusp of the most significant transition in the semiconductor industry in its history. It will surpass the development periods associated with the production of PCs and consumer electronics.

The essence of the upcoming changes can be judged at least by the title of the report: “New paradigms in silicon production”. According to Dr. Hwang, “the coming era of advances in electronics technology – the era of mergers – will be incredible in scale, encompassing information technology, biotechnology and nanotechnology, and opening up endless opportunities for new growth in the semiconductor industry.”.

Born out of the PC industry, which is now estimated at 200 million units per year, mobile and other consumer electronics are now more than 2 billion units annually. The “era of merger” will raise the market size to 6.5 billion units, and will affect, literally, every inhabitant of the planet.

The demand for semiconductor products is constantly growing, but in the future it will be determined by new, large flows of consumption. We are talking about biotechnology, healthcare, robotics, aerospace engineering, solar cell manufacturing and other areas of technology interpenetration characteristic of the “era of fusion”.

One of the key points that can determine further development will be overcoming today’s technological limitations. In particular, it is critical to go beyond the existing boundaries of technological standards for semiconductor manufacturing. This should give manufacturers control over the “limited number of electrons” and reduce the noise level inside semiconductor devices – in other words, bypass the factors that cause the most significant “bottlenecks” of 2D structures.

Samsung experts see the solution to these problems in the use of three-dimensional structures – “three-dimensional silicon”. Currently, this approach has been tested in relation to the simplest elements – transistors, but more global innovations are coming.

The beginning of the “era of merger” is expected around 2021, when the density of semiconductor chips will exceed the terabit threshold. The degree of integration will increase – more and more chips will include various types of memory, logic, sensors, processing elements.

Source: Samsung Electronics

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