You recently viewed.Kvaser USBcan Pro Dual USB to CAN Bus Interface — Sewell Direct
The Kvaser USBcan Pro 5xHS is a five channel, high performance, CAN bus interface that provides a quick and flexible way to connect a computer to multiple high-speed (ISO ) CAN buses. Kvaser CANlib SDK Software development kit – everything you need to develop software for the Kvaser CAN and LIN interfaces. Libraries, header files, sample programs for e.g. C, C++, C#, Visual Basic and Delphi, documentation, and more. Note: you need to download and Estimated Reading Time: 4 mins. Kvaser USBcan Light 2xHS, Dual USB to CAN Bus Interface The Kvaser USBcan Light 2xHS is a compact, reliable and cost-effective means of connecting two high speed CAN buses to .
Kvaser usbcan.Kvaser CAN and LIN Bus Interface Products | Sewell Direct
The USBcan Light 4xHS is a compact, reliable and cost-effective means of connecting four high speed CAN buses to a PC or mobile computer. With galvanic isolation as standard, this USB to quad channel CAN interface has a standard USB connector at one end and four high speed CAN channels in a single pin HD D-SUB CAN connector at the s: 1. The Kvaser USBcan Light 2xHS offers two high speed CAN channels and one USB compliant interface. With the three connectors at the end of fully galvanically isolated flexible wires, this device is designed to facilitate any application in which the CAN bus connectors aren’t easily accessible, such as hard to reach electronic control units (ECU) on a vehicle. The Kvaser USBcan R provides two CAN bus interfaces through a single USB connection. It is a robust, easy to carry device designed for high-end applications. With quick reaction times and high data throughput, the Kvaser USBcan R is perfect for rapid ECU re-flashing, advanced bus analyzers and efficient development work.
Kvaser USBcan Pro Dual USB to CAN Bus Interface
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Kvaser USBcan Light 2xHS USB Interface — Phytools
Kvaser USBcan Light 2xHS
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Kvaser USBcan R USB Interface — Phytools
NEC’s new technology to provide 32nm low-k chips with dielectrics
NEC and NEC Electronics Announce Interconnect Technology for 32nm Semiconductor ICs. It is reported that when creating connections, insulators with a low dielectric constant (low-k), created by plasma copolymerization technology, are used.
Recall that the need to use insulators with a low dielectric constant arises due to an increase in the influence of parasitic capacitance between the internal connections of a semiconductor chip with a decrease in the size of the elements. There are not many approaches to the creation of low-k dielectrics, one of which is the use of porous films, which have been successfully applied for 65 nm norms, but are no longer effective for finer norms. Plasma copolymerization technology adjusts the ratio between porous and rigid low-k film while maintaining capacitance at 83 fF / mm (femto-farad per millimeter).
Another approach to lowering the dielectric constant is to use organic films (for example, SiOCH) with low polarizability – such dielectrics have been used in 90nm microcircuits. Moreover, the same films, but only porous, are now being tested for use in 65-nm chips. Further development of this approach was carried out by NEC within the framework of the MIRAI project, creating an MPS (molecular-pore-stack, an array of molecular pores) -technology with a uniform distribution of sub-nanometer pores. MPS dielectrics are expected to be used in 45nm microcircuits.
However, for standards of 32 nm and less, the porosity of the dielectric film alone is not enough – in addition to them, a layer with high mechanical rigidity is usually used, which is usually performed in two successive stages. And the new development of NEC and NEC Electronics allows you to do it in one step and using one tool.